The Elma Bustronic SMT line is over 40' long and includes an in-line printer, a pick-and-place SMT assembly machine, re-flow soldering system, and a multi-solvent backplane cleaning machine. Our customers benefit with faster turnaround times, increased volume and board complexity capabilities, and higher precision quality.




SMT2220 In-Line Printer

The production line utilizes a SMT2220 In-Line printer for pick-and-place SMT assembly. With accurate printer alignment vision systems, the line facilitates high-speeds with the most precise component alignment. Alignment accuracy tolerance is to .0008" (1 pass), with 640H x 480V frame grabber resolution.

 

Samsung Advanced Component Placer

The Samsung Advanced Component Placer can place 21,000 Components Per Hour (CPH) utilizing the Dual Servo-Flying Vision System with Sliding Type Feeders. This machine can handle small components and BGAs and boards up to 20” x 24”.

 

Vitronics Soltec Thermal Processing System

The Vitronics Soltec XPM thermal processing system produces outstanding levels of uniformity and repeatability in solder re-flow. The heat convection is transferred through the body of the IC package and the PWB and directly into the solder joints. Their flux flow control system removes flux contaminants from each zone, resulting in clean heated tunnels.

 

 

 

The Nu/Clean 318 Aqueous Cleaner

This Nu/Clean 318 Cleaner is a high-pressure DI-Water base cleaner. It has a pre-wash chamber with 32 high-pressure spray nozzles, the wash chamber has 64 high-pressure spray nozzles, the rinse chamber has 80 high-pressure spray nozzles and the final rinse chamber has 12 high-pressure spray nozzles.

The cleaner also features one 10 HP high performance wash pump, one 10 HP high performance rinse pump, and three 15 HP high performance turbine air blower for high efficiency drying of printed circuit boards.

 

 

 

For special projects, we are able to use our automated assembly line in Germany. Over 40 meters long, the line includes SMT assembly, vapor phase soldering, press fit capability, electrical, and optical testing. The facility is located in Pforzheim, Germany.

 

 

SMT Assembly

  • Up to 10,000 components/hr
  • Assembly precision: +/- .1mm for chip components, +/- .03mm for fine pitch
  • PCB and component location by CCD camera
  • Visual check: components, missing or bent connections, panel processing

 

Vapor Phase Soldering

  • Vapor phase pre-heating
  • Infrared pre-heating

 

Press Fit

  • Press force: 81kN
  • Cycle time: 3-5 sec
  • Tool change type: revolver drum, change in 2-6 sec
  • Supervision of press-in process, measuring force and distance with tolerance requirements

 

Optical Test

  • CCD matrix camera verifying missing, displaced, twisted, or components with wrong polarity
  • Height measurement
  • Solder connection verification
  • Short circuit control for IC pins
  • Text verification

 

Electrical Test

  • Up to 21,620 test points (expandable to 300,000)
  • Voltage to 250V
  • Current to 50mA
  • 1000 measurements/sec
  • Isolation and continuity testing
  • High voltage testing of up to 2000 VAC, 1500 VDC