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The Elma Bustronic
SMT line is over 40' long and includes an in-line printer, a pick-and-place
SMT assembly machine, re-flow soldering system, and a multi-solvent
backplane cleaning machine. Our customers benefit with faster
turnaround times, increased volume and board complexity capabilities,
and higher precision quality.
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SMT2220
In-Line Printer
The production line utilizes a SMT2220 In-Line printer for pick-and-place
SMT assembly. With accurate printer alignment vision systems, the
line facilitates high-speeds with the most precise component alignment.
Alignment accuracy tolerance is to .0008" (1 pass), with 640H x 480V
frame grabber resolution. |
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Samsung Advanced Component Placer
The Samsung Advanced Component Placer can place 21,000 Components Per Hour (CPH) utilizing the Dual Servo-Flying Vision System with Sliding Type Feeders. This machine can handle small components and BGAs and boards up to 20” x 24”.
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Vitronics
Soltec Thermal Processing System
The Vitronics Soltec XPM thermal processing system produces outstanding
levels of uniformity and repeatability in solder re-flow. The heat
convection is transferred through the body of the IC package and
the PWB and directly into the solder joints. Their flux flow control
system removes flux contaminants from each zone, resulting in clean
heated tunnels.
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The Nu/Clean 318 Aqueous Cleaner
This Nu/Clean 318 Cleaner is a high-pressure DI-Water base cleaner. It has a pre-wash chamber with 32 high-pressure spray nozzles, the wash chamber has 64 high-pressure spray nozzles, the rinse chamber has 80 high-pressure spray nozzles and the final rinse chamber has 12 high-pressure spray nozzles.
The cleaner also features one 10 HP high performance wash pump, one 10 HP high performance rinse pump, and three 15 HP high performance turbine air blower for high efficiency drying of printed circuit boards.
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For special
projects, we are able to use our automated assembly line in
Germany. Over 40 meters long, the line includes SMT assembly,
vapor phase soldering, press fit capability, electrical, and
optical testing. The facility is located in Pforzheim, Germany. |
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SMT
Assembly
- Up
to 10,000 components/hr
- Assembly
precision: +/- .1mm for chip components, +/- .03mm for fine
pitch
- PCB
and component location by CCD camera
- Visual
check: components, missing or bent connections, panel processing
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Vapor
Phase Soldering
- Vapor
phase pre-heating
- Infrared
pre-heating
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Press
Fit
- Press
force: 81kN
- Cycle
time: 3-5 sec
- Tool
change type: revolver drum, change in 2-6 sec
- Supervision
of press-in process, measuring force and distance with tolerance
requirements
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Optical
Test
- CCD
matrix camera verifying missing, displaced, twisted, or
components with wrong polarity
- Height
measurement
- Solder
connection verification
- Short
circuit control for IC pins
- Text
verification
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Electrical Test
- Up
to 21,620 test points (expandable to 300,000)
- Voltage
to 250V
- Current
to 50mA
- 1000
measurements/sec
- Isolation
and continuity testing
- High
voltage testing of up to 2000 VAC, 1500 VDC
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