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Next-Gen
Backplanes, Part I
Developing
the next-gen communications system utilizing switched fabric
technology by StarGen, Bustronic is a proud to be a founding
member of the StarFabric Working Group. This is
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the
first installment of a series of articles featuring important
new technology developments. Others to come include a must-read
report on the features of the Ethernet backplane (PICMG 2.16).
StarFabric's
switch fabric is a high-speed, point-to-point backplane and
chassis-to-chassis interconnect solution. This new technology
addresses critical requirements including system scalability,
flexibility, High Availability (HA), and Quality of Service
(QoS) while maintaining compatibility with existing CompactPCI
architectures. One big advantage is that it is based on an
existing PCI-based technology. Therefore, no new software,
drivers, etc., need to be written. The technology will meet
the next-gen requirements for trunk speeds from OC3 to OC12/OC48
and handle 10K to 100K calls in a single chassis. Packet,
cell, and voice traffic will be able to flow through simultaneously.
The
StarFabric Working Group is a partnership of leading companies
dedicated to developing the next-generation communications
system. Initial members include Agere Systems (formerly Lucent
MicroElectronics), Bustronic, Elma, FCI/Berg, Motorola Computer
Group, Natural MicroSystems, Pigeon Point Systems, StarGen,
and Sun Microsystems. -More-
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PICMG
2.16 Update (cPSB Backplane)
The subcommittee,
which has been meeting regularly by teleconference and face-to-face
sessions, got together in Orlando on March 20th. Two working
groups presented material to the subcommittee: the 21-slot
group and the P1/P2 group. -More-
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Bustronic and
TreNew Share Resources
The parent company of Bustronic has purchased TreNew, one of
Europe's most esteemed backplane companies. The two groups will
combine the resources of several facets of their operations -- including
production capabilities, engineering resources, volume purchasing,
and shared product lines. TreNew has extensive expertise in high-speed
backplanes, particularly custom telecom applications. It also brings
a high-volume production line and top testing & simulation capability
to the table.
"By combining
resources, our customers will benefit from the increase in cost
savings, capacity, engineering resources, and product selection,"
said Fred Hirsch, General Manager of Bustronic. Headquartered in
Pforzheim, Germany, TreNew has manufacturing and engineering facilities
in Germany, and a design center in Romania.
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2-Slot and 5-Slot
CompactPCI Backplanes
Continuing the Bustronic tradition of offering the most complete
lines of cPCI and VME backplanes, Bustronic has developed two new
slot sizes in CompactPCI. The 2-slot version comes in a 7U form factor
and is ideal for 1U low-profile style chassis. The 5-slot cPCI features
an 8-layer stripline design in a 6U form factor, and is also available
with H.110. These right-justified backplanes conform to the latest
PICMG specifications. For more information, please visit http://www.bustronic.com/cpci/6u.html |
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