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Issue: Q2 2009 |
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Aside from high-performance backplane design, Bustronic also develops a wide range of RTMs, Adapters, and other custom boards. Particularly for staple technologies like VME64x and new architectures like VXS or VPX, custom and standard RTM designs can be very useful. An RTM helps bring IO off the backplane in a convenient pluggable module. More
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3U MicroSlim Backplane |
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2-slot ATCA Upgrade |
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Bustronic now offers a 3U version of its MicroSlim backplane line that fit in horizontal-mount MicroTCA enclosures. This increases performance density and a wide range of signal connector, power module, cooling unit, and other headers are available.
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Bustronic has upgraded its 2-slot ATCA backplane with highly dense connectors for plugging shelf managers. The slim connectors allow 2 shelf managers to be plugged into the backplane side-by-side while still allowing the solution to fit within a 2U high ATCA chassis.
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PICMG News |
VITA News |
Test Plans are being created for MicroTCA.3 (Hardened Conduction Cooled) for Rugged MicroTCA.
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A new initiative called OpenVPX has been launched. The purpose of OpenVPX is to develop a VPX system specification that defines system-level, interoperable architectures. Bustronic has joined this initiative and has co-sponsored the VITA 65 specification that will bring OpenVPX efforts into the VSO process.
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