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PICMG
2.17 Update (Starfabric)
The PICMG
2.17 subcommittee for StarFabric met on Sept. 6th in Boston.
Over 65 companies have joined the subcommittee. Simulations
was one of the key subjects that was discussed. Several companies,
including Bustronic/Elma, submitted bids to do the simulation
work. There was also a lot of discussion on connectors, from
minor details like pin tail lengths and shrouds to larger
issues like future revision high-speed connectors. Bustronic/Elma
did a brief presentation on high-speed connectors like the
ZD, Metral, and VHDM types from the major connector companies.
The technology
is coming along quickly. So far, StarGen has released both
switch chips, Agere announced their StarFabric-to-H.110 bridge,
Bustronic developed a StarFabric backplane prototype, and
Elma has created modeling for a prototype chassis.
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