 |
An
Intro to AdvancedTCA (PICMG 3.x)
PICMG
is embarking on its largest and most aggressive effort ever,
the AdvancedTCA (Advanced Telecom Computing Architecture)
specification. Formerly known as PICMG 3.x, the core specification
PICMG 3.0 currently contains three sub-specifications. PICMG
3.1 is the specification for Ethernet and is similar in background
to the PICMG 2.16 specification. PICMG 3.2 is for Infiniband
and PICMG 3.3 is for StarFabric implementation.
The specification
is positioned towards the $200 billion and growing telco carrier
grade market. Particularly in telecom central offices, the
industry currently tends to use large, heavy layer-count,
and powerful custom telecom backplanes (see
a few Bustronic examples). The overall system is geared
to be NEBS (Network Equipment Building Systems) compliant.
A NEBS compliant product generally implies that it has been
tested to GR-63 for environmental and GR-1089 for the EMI/EMC
and safety. (-more-)
|
|
| VITA News |
 |
New
VMEbus backplane proposal - VXS Backplane
There
is a newly proposed backplane standard to bring serial switched
signals through the P0 connector of a VME64x backplane - the
VXS Backplane. The idea has bounced around for a while to
have optical or high-speed copper interconnects over P0. New
high-speed serial connectors are being proposed for the P0
connector, such as one dubbed "Rolling Thunder" from Tyco
Electronics. It's not yet clear what competing connector manufacturers
will propose. (-more-)
|
|
| |
|
|
|
 |
Bustronic Expands
Manufacturing Capabilities with New SMT Assembly Line

The company has purchased a new SMT (surface mount technology) production
line, enhancing Bustronic's ability to rapidly manufacture large
volumes of backplanes with surface-mount components. Benefits include
faster production times, increased volume and board complexity capabilities,
and higher precision quality.
|
 |
Coming Soon
The Bustronic
Web site will feature a Capabilities presentation. The slides with
include photos of the new SMT assembly line, some of Bustronic's
testing equipment, and examples of backplanes for various industries.
The presentation
will also include background on the company, design & testing
capabilities and more.
|
| |
|