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ELMA BUSTRONIC ANNOUNCES NEW MicroTCA CUBE-FORMAT BACKPLANE

FREMONT, California, August 7, 2007 - Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes has announced a new MicroTCA backplane in the Cube style format. The backplane features 6 AdvancedMC, 1 MicroTCA Carrier Hub, and 1 Power Module slot.

The Bustronic backplane has a Star topology and fits in a 4U wide Cube-style MicroTCA portable enclosure. The backplane also features a JSM (J-Tag Switch Module) slot, and connections at the bottom for a Cooling Unit and at the top for temperature sensors. The 12-layer routing includes 12 ports, including Fat Pipe lanes and allocations for PCI-Express traffic.

The pinout of Connector 2 of the MCH is the first alternative pinout defined in the MicroTCA Spec. This pinout contains half a Fabric (Fabric B) and three clock networks. The Fabric on this connector is not used at all, instead the according Ports 2 and 3 of the AMCs are connected directly between the cards.

Bustronic also offers MicroTCA backplanes in both Star and Dual Star topologies and in Pico and Subrack formats.