ELMA BUSTRONIC EXPANDS LOW PROFILE™ COMPACTPCI BACKPLANE LINE

FREMONT, California, Feb 9, 2005 - Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes has expanded its line of Low Profile™ CompactPCI backplanes with new 3U and 6U versions. The company also offers several new packet switching versions compliant to the PICMG 2.16 specification.

The Bustronic Low Profile cPCI line saves a slot-size of width by placing power studs and power blades between the slots and throughout key locations on the backplanes. This allows the 4-slot Low Profile cPCI to fit within a 2U horizontal chassis and the 8-slot to fit within a 4U horizontal chassis, etc. The new sizes include a 3-slot 3U, a 3-slot 6U, and several sizes in PICMG 2.16 configurations.

The Low Profile backplanes allow more room in the chassis, providing flexibility of choice for designers. By using less space in the chassis, the backplanes offer more options for recessing of cards, installation of drives, a cable pass-through, and different power supply units to be used. Further, for rugged applications, there is room for rope coil isolators, dampers, etc.

All Bustronic cPCI backplanes are designed to be fully compliant to the PICMG basic specification 2.0 R3.0 and Hot Swap specification 2.1 R1.0. They incorporate computer-simulated stripline design for high performance. With optimal power dispersion and distributed high and low frequency decoupling capacitors, the CompactPCI
backplanes deliver virtually zero crosstalk.