MicroTCA MicroSlim Backplane

  Mechanical Specifications
 

1U, 3U heights
  Full size modules
  Compression connectors

  Board Specifications
  20-layer board (passive 1U), 14-layer board
(active 1U), 24-layer board (3U)
  2 oz. copper power and ground
  PCB UL listed 94V-0
  PCB FR-4 or equivalent

MicroTCA Backplanes - MicroSlim

Key Features
Complies to MicroTCA.0 Specification Rev 1.0
Star and Dual Star Topology options
Optimized via signal integrity studies
Compression-mount connectors for improved
performance, reliability and field replacement capability
Passive and active versions available
Active version has IPMB-0 intelligence for power and
cooling unit installed across the backplane
Active version has direct PCIe, GbE, XAUI and
SATA connections


Download data sheet file 130KB


MicroTCA User Manual 198KB
 




MicroTCAStar Backplanes
MicroTCA Dual Star Backplanes
 AdvancedTCA Dual Star
AdvancedTCA Mesh
AMC Load Board
AMC Extender Board
 MicroTCA RTMs
Chassis



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